System and method for providing a low and narrow-profile radio frequency identification (rfid) tag

ABSTRACT

Methods and systems for wireless devices are disclosed. According to one system, a radio frequency identification (RFID) tag includes an RFID circuit packaged within a chip carrier package. The chip carrier package bonds out a first antenna connection for the RFID circuit. An antenna including a conductive lead is interfaced with the first antenna connection. The chip carrier package and the first conductive lead are coupled to a first side of a first spacer. A second spacer having a second dielectric constant greater than the first dielectric constant is coupled to a second side of the first spacer. The second spacer isolates the RFID circuit from a metal surface.

RELATED APPLICATIONS

This application claims priority to and claims the benefit of U.S.Provisional Application Ser. Nos. 60/818,754, entitled “MINI-METAL TAGAND RAPID WRAP RFID,” filed on Jul. 5, 2006; 60/822,785, entitled“MINI-METAL TAG AND RAPID WRAP RFID,” filed on Aug. 18, 2006; and60/894,499, entitled “MINI-METAL RADIO FREQUENCY IDENTIFICATION (RFID)TAG WITH FLEX-SET,” filed on Mar. 13, 2007, all of which areincorporated herein by reference in their entirety.

FIELD OF THE INVENTION

The present invention relates to wireless communication device tagtechnology, and particularly to low and narrow-profile radio frequencyidentification (RFID) tags having a small form factor which are capableof use on a metal surface in forms adapted to attach on articles ofmanufacture and are protected from environmental conditions.

BACKGROUND OF THE INVENTION

Radio Frequency Identification (RFID) technology is useful foridentifying goods and articles of manufacture. RFID systems are commonlyused in inventory or shipping processes to track such goods. RFIDtechnology utilizes RFID devices which are physically placed on an itemto be tagged. The RFID devices are based on either passive or activetechnology. Active RFID devices are powered devices that activelytransmit a signal including an identifier that is associated with thetagged item. Passive RFID devices do not include power supplies and, assuch, do not actively transmit a signal. Instead, passive RFID devicesrely on electrical field energy provided by an RFID interrogator withinan incoming RFID wave to power up electronics, including a passive RFIDdevice and an associated antenna. The passive RFID device and theassociated antenna rely upon use of a physical wave propagationphenomenon called “backscatter,” by which waves are reflected backtoward a source. As such, a passive RFID device interrupts and reflectsan incoming RFID signal back to the RFID interrogator to communicateidentification information rather than driving power transmitterelectronics.

RFID signals are relatively low-power signals which do not propagatethrough open spaces beyond a few meters. Metal or other reflectivesurfaces also tend to interfere with the propagation of RFID signals.Until the recent advent of RFID insulating materials, RFID tags couldnot be used on metal surfaces. However, even with this advancement,large form factors are required to sufficiently shield the RFID devicesfrom the metal surface, particularly for passive RFID devices which usebackscatter reflection communication techniques. Additionally,conventional RFID devices are large and often damaged when directlyattached to objects which are shipped or stored without a carton orcontainer.

Accordingly, there exists a need to provide low and narrow-profile RFIDtags having a small form factor which are capable of use on a metalsurface, are adapted to attach easily onto goods to be tracked in theirnatural environment, and are able to be used without damage to the RFIDtag, and are protected from environmental conditions.

SUMMARY OF THE INVENTION

The present invention relates to a system and method of providing a lowand narrow-profile RFID tag (hereinafter the “RFID tag”) with a smallform factor which is capable of use on a metal surface. Due to the smallform factor, the RFID tags of the present invention may be placed ontoand conform to surfaces more readily than conventional RFID devices andmay be used within a variety of harsh environmental conditions. Amagnetic material with a relatively high dielectric constant forms afoundation layer for the RFID tag. An insulating layer with a relativelylow dielectric constant is applied to the foundation layer, an RFID tagis placed on the insulating layer, and a dipole antenna is constructedover the insulating layer. The RFID tag is adapted to be used on a metalsurface and to provide a read range suitable for typical RFID-basedapplications. The RFID tag may be attached to the metal surface in avariety of ways, such as by tape, strapping, or other fasteners.

In an alternative embodiment, the low and narrow-profile RFID tag ismounted on a circuit board. Pads on the circuit board are provided forsolder connections to the RFID chip. Additionally, pads are provided onthe circuit board for solder connection of the dipole antenna. Thesolder pads for the dipole antenna form mechanical and electricalbonding locations for the dipole antenna.

In an alternative embodiment, an environmental encapsulate is used tocover at least a portion of the low and narrow-profile RFID tag toprotect it from environmental conditions. The environmental encapsulatemay shield the low and narrow-profile RFID tag from contaminants, water,temperature, and impact. The environmental encapsulate may be, forexample, shrink wrap, direct molded material, vulcanized rubber, or apre-mold case.

Several attachment and encapsulation embodiments are possible whichallow the RFID tags of the present invention to be placed onto uneven orcurved surfaces. Certain of the embodiments increase flexibility andshape retention of the RFID tags to improve attachment capabilities byreducing stress on fasteners. Other embodiments include attachmentmembers as part of the RFID tag itself to ease in the attachment to andremoval from objects to be identified. Other embodiments provideincreased protection of the RFID tags from environmental conditions. TheRFID tags of the present invention provide a natural fit to the item theRFID tag is attached to and provide a resilient member for increasedenvironmental protection.

In an alternate embodiment, the low and narrow-profile RFID tag may beattached to a cylindrical or tubular surface using a rapid wraptechnology. The rapid wrap technology utilizes a rolled flexiblecylindrical material with the RFID tag fastened to the inside of therolled flexible cylindrical material. The rolled flexible cylindricalmaterial is unrolled and applied to the round surface and may beretained by the memory reflex of the rolled flexible cylindricalmaterial. The rolled flexible cylindrical material may be furthersecured to the round surface by a faster such as tape, strapping, orother fasteners.

An alternate embodiment provides a low and narrow-profile RFID tag withcurve set capabilities that preserves its shape when bent or formed tomatch contours of a mounting surface. By independently maintaining theshape of the surface to which it is attached, the RFID tag with curveset capabilities produces less strain on mechanical fastening systemssuch as straps, glue, or others, that hold the tag to the surface. Assuch, the RFID tag with curve set capabilities may be used in a varietyof industrial, construction, and other environments to tag objects withboth flat and uneven surfaces. For example, the RFID tag with curve setcapabilities may be formed by coupling a RFID tag to at least one wireto form a reinforced RFID tag. The RFID tag may be coupled to the wireby use of double-sided tape or any other suitable material that providesa flexible medium between the wire and the RFID tag. The wire gauge isselected such that the reinforced RFID tag preserves its shape whenbent, even when coupled to the RFID tag with curve set capabilities.

In yet an alternate embodiment, a low and narrow-profile RFID tag isplaced behind and coupled to a rigid angular or rectangular frame toimprove impact resilience of the RFID tag. The frame is made of amaterial such as metal (e.g., steel or aluminum) capable of impactresistance. Slots are cut approximately perpendicular to the length ofthe rigid frame to reduce RFID shielding of the frame. The slots may becut at intervals along a portion of the length of the frame to allow auseable RFID signal level and read performance for the RFID tag whenplaced within a void (e.g., on the underside or backside) of the framematerial. The RFID tag is then placed within a void of the frame andfastened to the frame by glue or another type of fastener.

In an alternate embodiment, a slot or hole may be cut in the low andnarrow-profile RFID tag to allow it to be fastened to a mounting surfaceindependently of the frame. Furthermore, one or more slots may be cutaxially with respect to the length of the frame base to allow the frameto be fastened with a strap or straps to the mounting surface. The RFIDtag may further be attached to the frame via any suitable means, such asa metal or fiber strap, or glue. The frame may be attached to themounting surface by direct welding, metal or fiber straps as describedabove, a rugged tape of belts, or any other fastener suitable for usewith the mounting surface.

In an alternate embodiment, a vulcanized rubber encapsulation of the lowand narrow-profile RFID tag is provided to provide a ruggedized RFID tagcapable of providing impact resistance and environmental isolation forthe RFID tag. The ruggedized RFID tag is formed by placing at least onelayer of pre-cured rubber within a mold, placing the RFID tag on thepre-cured rubber, and placing at least one additional layer of thepre-cured rubber on top of the RFID tag. The process continues byheating the layers of rubber and the RFID tag to bond the layers ofrubber together to form a vulcanized rubber encapsulation of the RFIDtag under the pressure of the sealed mold. This vulcanized rubberencapsulation of the RFID tag is ruggedized and flexible such that itmay be bent to conform to and be placed upon a contoured or unevensurface. The ruggedized RFID tag provides impact resistance and thesealed vulcanized rubber provides additional protection from waterpenetration or other environmental compromise of the encapsulated RFIDtag.

In an alternate embodiment, an o-ring may be integrated into thevulcanized low and narrow-profile RFID tag of the previous embodiment toease attachment and removal of the RFID tag to and from the item to beidentified. This integrated o-ring is provided by placing an o-ringwithin the mold during fabrication of the vulcanized rubberencapsulation of the RFID tag. This o-ring provides mechanical strappingcapabilities for fastening the vulcanized RFID tag to a product, such asa pipe. By integrating the o-ring into the vulcanized RFID tag duringmanufacture, a fastening system is mechanically-bonded to the vulcanizedRFID tag. This vulcanized RFID tag with integrated o-ring provides forefficient installation and removal of the vulcanized RFID tag andprovides for ease of reuse of the vulcanized RFID tag.

In an alternate embodiment, reinforced pre-hardened rubber strips areintegrated into a vulcanized low and narrow-profile RFID tag to provideadditional impact protection.

A “ring tag” embodiment is also provided which encapsulates a low andnarrow-profile RFID tag within a ring-shaped encapsulate. Thering-shaped encapsulate is sized according to the dimensions of the itemto be tagged. The ring-shaped encapsulate is stretchable to allow it tobe placed over the item to be tagged and has enough surface resistanceto allow it to resist movement along the surface of the item to preventit from falling off of the item to be tagged. The low and narrow-profileRFID ring tag may additionally be attached to the surface in a varietyof ways, such as by tape, strapping, or other fasteners.

Those skilled in the art will appreciate the scope of the presentinvention and realize additional aspects thereof after reading thefollowing detailed description of the preferred embodiments inassociation with the accompanying drawing figures.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawing figures incorporated in and forming a part ofthis specification illustrate several aspects of the invention, andtogether with the description serve to explain the principles of theinvention.

FIG. 1 illustrates an exemplary chip carrier package embodiment of a lowand narrow-profile radio frequency identification (RFID) deviceaccording to an embodiment of the subject matter described herein;

FIG. 2 illustrates a circuit board-mounted version of the low andnarrow-profile RFID device of FIG. 1;

FIG. 3 illustrates an exemplary top view of the low and narrow-profileRFID device illustrated in FIG. 2;

FIG. 4 illustrates an exemplary top view of the low and narrow-profileRFID device of FIG. 3 employing a dipole braided wire antenna forimproved read range performance, according to an embodiment of thesubject matter described herein;

FIG. 5 illustrates an exemplary top view of the low and narrow-profileRFID device of FIG. 3 employing a dipole spring wire antenna to improveflexibility of the RFID device;

FIG. 6 illustrates the low and narrow-profile RFID device of FIG. 1 withan environmental encapsulate forming a boundary to shield the RFIDdevice from penetration of environmental contaminants, water,temperature, and impact according to an embodiment of the subject matterdescribed herein;

FIG. 7 illustrates an exemplary cross section of the low andnarrow-profile RFID device of FIG. 6;

FIG. 8 illustrates an exemplary cross section of a metal pipe taggedwith the low and narrow-profile RFID device of FIG. 7 according to anembodiment of the subject matter described herein;

FIG. 9 illustrates a block diagram of an exemplary communication systemfor communication between a wireless device, such as a low andnarrow-profile RFID tag, and an interrogator according to an embodimentof the subject matter described herein;

FIG. 10 illustrates an exemplary low and narrow-profile RFID deviceencapsulated within a shrink wrap material to shield the low andnarrow-profile RFID device from environmental contaminants, water,temperature, and impact according to an embodiment of the subject matterdescribed herein;

FIG. 11 illustrates an exemplary low and narrow-profile RFID deviceencapsulated within a pre-molded case to shield the low andnarrow-profile RFID device from environmental contaminants, water,temperature, and impact according to an embodiment of the subject matterdescribed herein;

FIG. 12 illustrates an exemplary rapid-wrap packaging embodiment of alow and narrow-profile RFID device according to an embodiment of thesubject matter described herein;

FIG. 13 illustrates an exemplary rapid-wrap packaging embodiment of alow and narrow-profile RFID device attached to a section of scaffoldingto identify the section of scaffolding according to an embodiment of thesubject matter described herein;

FIG. 14 illustrates an exemplary low and narrow-profile RFID device withcurve set capabilities provided by placing one or more wires beneath themagnetic base of the low and narrow-profile RFID device to allow thedevice to be shaped into a contour of a surface and to hold the shape,thereby reducing stress on fastening materials according to anembodiment of the subject matter described herein;

FIG. 15 illustrates an exemplary cross section of the low andnarrow-profile RFID device of FIG. 14;

FIG. 16 illustrates an exemplary bent low and narrow-profile RFID deviceof FIG. 10;

FIG. 17 illustrates an exemplary low and narrow-profile RFID device witha slotted mechanical impact barrier providing additional protection fromimpact with the slots providing signaling pathways through the angleiron according to an embodiment of the subject matter described herein;

FIG. 18 illustrates an exemplary cross section of a low andnarrow-profile RFID device with a rubber encapsulate, such as vulcanizedrubber, to provide additional impact protection in addition toenvironmental encapsulation according to an embodiment of the subjectmatter described herein;

FIG. 19 illustrates an exemplary low and narrow-profile RFID device witha rubber encapsulate, such as vulcanized rubber, attached to a piece ofpipe with a strap according to an embodiment of the subject matterdescribed herein;

FIG. 20 illustrates an exemplary low and narrow-profile RFID device witha rubber encapsulate, such as vulcanized rubber, and an integratedo-ring for allowing the RFID device to be readily attached to a round orother-shaped surface according to an embodiment of the subject matterdescribed herein;

FIG. 21 illustrates the low and narrow-profile RFID device of FIG. 20attached to a pipe;

FIG. 22 illustrates an exemplary cross section of a low andnarrow-profile RFID device within a rubber encapsulate, such asvulcanized rubber, with reinforced pre-hardened rubber strips placedalong the length of the RFID device for additional impact protectionaccording to an embodiment of the subject matter described herein; and

FIG. 23 illustrates an exemplary ring tag low and narrow-profile RFIDdevice within a rubber encapsulate, such as rubber tubing, and formedinto a ring for attachment to round objects of a given diameteraccording to an embodiment of the subject matter described herein.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The embodiments set forth below represent the necessary information toenable those skilled in the art to practice the invention and illustratethe best mode of practicing the invention. Upon reading the followingdescription in light of the accompanying drawing figures, those skilledin the art will understand the concepts of the invention and willrecognize applications of these concepts not particularly addressedherein. It should be understood that these concepts and applicationsfall within the scope of the disclosure and the accompanying claims.

The present invention relates to a system and method of providing a lowand narrow-profile RFID tag (hereinafter the “RFID tag”) with a smallform factor which is capable of use on a metal surface. Due to the smallform factor, the RFID tags of the present invention may be placed ontoand conform to surfaces more readily than conventional RFID devices andmay be used within a variety of harsh environmental conditions. Amagnetic material with a relatively high dielectric constant forms afoundation layer for the RFID tag. An insulating layer with a relativelylow dielectric constant is applied to the foundation layer, an RFID tagis placed on the insulating layer, and a dipole antenna is constructedover the insulating layer. The RFID tag is adapted to be used on a metalsurface and to provide a read range suitable for typical RFID-basedapplications.

In alternative embodiments, the low and narrow-profile RFID tag ismounted on a circuit board and/or an environmental encapsulate is usedto cover at least a portion of the low and narrow-profile RFID tag toprotect it from environmental conditions. It should be noted that theenvironmental encapsulate may be used to protect any wirelesscommunication electronics, and that the environmental encapsulate is notlimited to use with an RFID tag. A circuit board for the RFID tagprovides mechanical integrity for circuit connections, whileenvironmental encapsulate embodiments may shield the low andnarrow-profile RFID tag from contaminants, water, temperature, andimpact. The environmental encapsulate may be, for example, shrink wrap,a pre-molded case, a slotted rigid angular or rectangular frame,vulcanized rubber, or reinforced pre-hardened rubber strips integratedinto vulcanized rubber. Other environmental encapsulates are possibleand all are considered within the scope of the subject matter describedherein.

Several attachment and encapsulation embodiments are possible whichallow the RFID tags of the present invention to be placed onto uneven orcurved surfaces. Certain of the embodiments increase flexibility andshape retention of the RFID tags to improve attachment capabilities byreducing stress on fasteners. Other embodiments include attachmentmembers as part of the RFID tag itself to ease attachment to and removalfrom objects to be identified. Other embodiments provide increasedprotection of the RFID tags from environmental conditions. The RFID tagsof the present invention provide a natural fit to the item the RFID tagis attached to and provide a resilient member for increasedenvironmental protection. As an example, a rapid wrap rolled flexiblecylindrical material may be used with the RFID tag fastened to theinside of the rolled flexible cylindrical material for application ofthe RFID tag to round surfaces. Additionally, curve set capabilities maybe used to allow the RFID tag to preserve its shape when bent or formedto match contours of a mounting surface. For example, the RFID tag withcurve set capabilities may be formed by coupling a RFID tag to at leastone wire to form a reinforced RFID tag with curve set capabilities. Ano-ring may be integrated into a vulcanized low and narrow-profile RFIDtag by placing an o-ring within a mold during fabrication of thevulcanized rubber encapsulation of the RFID tag. Alternatively, a “ringtag” embodiment is also provided which encapsulates a low andnarrow-profile RFID tag within a ring-shaped encapsulate. Thering-shaped encapsulate is sized according to the dimensions of the itemto be tagged. The low and narrow-profile RFID ring tag may additionallybe attached to the surface in a variety of ways, such as by tape,strapping, or other fasteners. Other fastening embodiments are possibleand all are considered within the scope of the subject matter describedherein.

FIG. 1 illustrates an exemplary chip carrier package embodiment of a lowand narrow-profile radio frequency identification (RFID) tag(hereinafter the “RFID tag”) 10. The low and narrow-profile RFID tag 10includes a chip carrier package 12, which includes RFID electronics forproviding RFID identification signals when interrogated by a reader (seeFIG. 9 below). The chip carrier package 12 provides environmentalprotection for the RFID electronics. The chip carrier package 12 may be,for example, a small-outline package (SOP) for an electronic circuit.Details of SOP package specifications are published, for example, by theJEDEC Solid State Technology Corporation (hereafter “JEDEC”), ofArlington, Va., and are available at www.jedec.org. The SOP package isgenerally defined by JEDEC as a package whose chip cavity area occupiesa major fraction of the package area. A variety of terminal and leadarrangements are available with an SOP package. RFID electronics havenot been previously known to have been packaged within an SOP-style chipcarrier package. Benefits of packaging the RFID electronics within theSOP-style chip carrier package include a substantially reduced formfactor for the RFID tag 10 relative to conventional RFID devices.Additionally, the small form factor of the SOP-style chip carrierpackage provides for improved conformity of the RFID tag 10 with unevensurfaces.

A dipole antenna 14 provides wave propagation capabilities to the RFIDelectronics within the chip carrier package 12. The dipole antenna 14 isa symmetrical dipole antenna tuned for the frequency of propagationwithin a given RFID system. However, the dipole antenna 14 may be anasymmetrical dipole antenna or a monopole antenna without departure fromthe scope of the subject matter described herein. Tuning of the dipoleantenna 14 may be performed by adjusting the length of each of a leftside 16 and a right side 18 of the dipole antenna 14 to be anappropriate fraction of or multiple of a usable wave length within agiven RFID system.

The chip carrier package 12 and the dipole antenna 14 are shown mountedor attached to a spacer material 20. The spacer material 20 is shownattached to a magnetic-base material 22. The spacer material 20 and themagnetic-base material 22 work in conjunction to form an isolationbarrier between RFID electronics within the chip carrier package 12 andthe dipole antenna 14 relative to a metal surface 24 upon which the lowand narrow-profile RFID tag 10 is mounted. The spacer material 20 andthe magnetic-base material 22 may be separate layers of material or maybe constructed as one layer with a dielectric constant gradient thatincreases in the direction of the metal surface 24. Additionally, thespacer material 20 and the magnetic-base material 22 may be fabricatedtogether as two materials having a low dielectric constant and a highdielectric constant, respectively. An exemplary commercially-availablematerial that may be used for the spacer material 20 and themagnetic-base material 22 is ECCOsorb®, sold by Emerson and CumingMicrowave Products of Randolph, Mass. Additionally, U.S. Pat. No.7,205,898, entitled “RFID TAGS,” to Dixon et al. describes materialsthat may be used for the spacer material 20 and the magnetic-basematerial 22. U.S. Pat. No. 7,205,898 is incorporated by reference in itsentirety as if fully set forth herein.

FIG. 2 illustrates an exemplary chip carrier package embodiment of thelow and narrow-profile RFID tag 10 where the chip carrier package 12 andthe dipole antenna 14 are mounted on a circuit board 26. The circuitboard 26 provides a rigid mounting surface for the chip carrier package12, including the RFID electronics described in association with FIG. 9below, and provides solder connection pads for the dipole antenna 14.The use of the circuit board 26 may improve mechanical integrity ofexternal antenna connections to the RFID tag 10. The use of the circuitboard 26 provides mechanical integrity to the circuit connectionsbetween the chip carrier package 12 and the dipole antenna 14.

FIG. 3 illustrates an exemplary top view of a chip carrier packageembodiment of the low and narrow-profile RFID tag 10 where the dipoleantenna 14 includes a dipole wire antenna 28. The dipole wire antenna 28may be dimensioned of an appropriate gauge to provide adequate signalpropagation for a given desired read range.

FIG. 4 illustrates an exemplary top view of a chip carrier packageembodiment of the low and narrow-profile RFID tag 10 where the dipoleantenna 14 includes a dipole braided wire antenna 30. The dipole braidedwire antenna 30 provides an increased current carrying capability for agiven diameter relative to the dipole wire antenna 28 due to theincreased surface area for current conduction over the surface of thebraids of the dipole braided wire antenna 30. Furthermore, a braidedwire antenna, such as the braided wire antenna 28, may be used with anywireless communication device and provides increased flexibility over aconventional wire antenna without increasing stress on antennaconnections for the wireless communication device. As with the dipolewire antenna 28, the dipole braided wire antenna 30 may be dimensionedof an appropriate gauge to provide adequate signal propagation for agiven desired read range. For example, a gauge of eighteen for thedipole braided wire antenna 30 was found to provide a 3 dB increaserelative to a gauge of twenty-four in a single wire formed into aspring, which is described in association with FIG. 5 below. The dipolebraided wire antenna 30 may include tabs 32 and 34 at its ends. However,it should be noted that the tabs 32 and 34 are optional and areillustrated within FIG. 4 to show where the tabs 32 and 34 may be placedif optionally used. The tabs 32 and 34 may be useful for maintainingintegrity of the braided ends, but may also used for tuning the lengthof the dipole braided wire antenna 30 for frequency response.

FIG. 5 illustrates an exemplary top view of a chip carrier packageembodiment of the low and narrow-profile RFID tag 10 with a dipolespring wire antenna 36. The dipole spring wire antenna 36 allows forincreased flexibility of the RFID tag 10 with potentially decreasedfatigue of the mechanical integrity of the dipole spring wire antenna 36relative to other embodiments, as described above. However, the dipolespring wire antenna 36 has not been shown to have the increased readsignal strength of those embodiments. As with the embodiment of FIG. 4,the tabs 32 and 34 may be optionally included with the dipole springwire antenna 36 and, if used, may be useful for tuning the length of thedipole spring wire antenna 36 for frequency response.

It should be noted that any antenna embodiment used without a circuitboard may provide electrical connectivity between the respective dipoleantenna and the chip carrier package 12 by direct solder connections toterminals or leads of the chip carrier package 12 which bond out antennaconnections to the RFID circuitry within the chip carrier package 12.Furthermore, any antenna embodiment, such as an asymmetrical dipoleantenna or a monopole antenna, may be used with a circuit board, asdescribed in association with FIG. 2 above. In such an embodiment,electrical connectivity may be provided between the respective dipoleantenna and the chip carrier package by direct solder connections totraces, vias, or pads which electrically connect to terminals or leadsof the chip carrier package which bond out antenna connections to theRFID circuitry within the chip carrier package.

FIG. 6 illustrates an exemplary chip carrier package embodiment of thelow and narrow-profile RFID tag 10 with an environmental encapsulate 38forming a boundary to shield the RFID tag 10 from penetration ofenvironmental contaminants, water, temperature, and impact. Theenvironmental encapsulate 38 may take many forms, as will be describedin more detail beginning with FIG. 10 below. It should be noted that theenvironmental encapsulate 38 encapsulates all components of the RFID tag10. It should further be noted that the environmental encapsulate 38 orany variant thereof may be used to protect any wireless communicationelectronics, and that the environmental encapsulate 38 or any variantthereof is not limited to use with an RFID tag.

FIG. 7 illustrates an exemplary cross section of a chip carrier packageembodiment of the low and narrow-profile RFID tag 10 with anenvironmental encapsulate 38 forming a boundary to shield the RFID tag10 from penetration of environmental contaminants, water, temperature,and impact. FIG. 7 illustrates that the environmental encapsulate 38does not need to encapsulate the bottom of the magnetic-base 22 toprovide shielding effects from penetration of environmentalcontaminants, water, temperature, and impact. Furthermore, withoutencapsulating the bottom of the magnetic-base 22, the dielectricconstant balance between the spacer material 20 and the magnetic-base 22relative to the metal surface 24 (not shown) may be maintained. However,the bottom of the RFID tag 10 may be encapsulated without departure fromthe scope of the subject matter described herein. Additionally, itshould be noted that the environmental encapsulate 38 may be of anysuitable dimension relative to the form factor of the RFID tag 10.

FIG. 8 illustrates an exemplary cross section of a metal pipe 40detailing relative dimensional differences between the low andnarrow-profile RFID tag 10 of the present invention and a conventionalmetal tag 40. The metal pipe 40 is illustrated with the conventionalmetal tag 42 in contact with a surface of the metal pipe 40. The bottomedges of the conventional metal tag 42 do not contact the surface of themetal pipe 40 at its corners 44 and 46 due to the dimensionaldissimilarity between the conventional metal tag 42 and the metal pipe40. In contrast, the RFID tag 10 contacts the metal pipe 40 along itsentire width. This improved contact with the surface of the metal pipe40 along with the smaller dimensions of the RFID tag 10 relative to theconventional metal tag 42 is believed to contribute to increasedperformance of the RFID tag 10 when compared to the conventional metaltag 42. Additionally, flexibility of the spacer material 20 and themagnetic-base material 22 contribute to improved contact with the metalpipe 40 and allow for improved fastening of the RFID tag 10 to the metalpipe 40 when adherents, such as glue, are used to fasten the RFID tag 10to the metal pipe 40.

FIG. 9 illustrates a block diagram of an exemplary communication system50 for communication between a wireless device, such as the low andnarrow-profile RFID tag 10, and an interrogator 52. The presentinvention includes the RFID tag 10 for electronic communication. Someembodiments of the RFID tag 10 have both a transmitter and receiver.Other embodiments of the RFID tag 10, known in the art as“transponders,” are interrogated by the interrogator 52, whereby thetransponder communicates back by altering a field 54 containing aninterrogation signal 56. This description refers to the terms“transponder,” wireless communication device, and the RFID tag 10interchangeably, and the use of the term transponder is not intended tolimit the type of wireless communication device applicable to thepresent invention. Wireless communication devices are available thatcommunicate at various frequencies, including ultra high frequency (UHF)and very high frequency (VHF). One embodiment of the present inventionuses the RFID tag 10 that is a passive radio-frequency device with theability to rectify incoming radio energy and provide power to power thedevice for communication and operation. The present invention is alsoapplicable to active devices that have their own power source forcommunications. It should be readily understood to one of ordinary skillin the art that there are many different types of wireless communicationdevices that allow electronic communication and thus the presentinvention is not limited to any one particular type.

The low and narrow-profile RFID tag 10 includes a control system 58 andcommunication electronics 60. The RFID tag 10 may also include a memory62 for storage of information to be communicated to the interrogator 52.Alternatively, the RFID tag 10 may store information such as anidentification number or other information by using diodes, dipswitches, or some other like circuitry in lieu of the memory 62. Anantenna 64 is provided to receive the interrogation signal 56 from theinterrogator 52. The antenna 64 may be the dipole antenna 14 or anyother antenna embodiment and may be either external to or internal tothe RFID tag 10. The particular type and location of the antenna 64 willdepend on the operating frequency of the RFID tag 10 and the particulardesign desired. The RFID tag 10 may also be connected to a sensor 66 forsensing ambient or environmental information surrounding the RFID tag10. One example of the sensor 66 may be a quartz crystal resonator likethat described in U.S. Pat. No. 5,922,550, entitled “BIOSENSING DEVICESWHICH PRODUCE DIFFRACTION IMAGES” to Everhart et al., which isincorporated herein by reference in its entirety. A quartz crystalresonator detects analytes that may be present in food. Analytesinclude, but are not limited to, microorganisms such as bacteria,yeasts, fungi, and viruses.

The antenna 64 receives the interrogation signal 56 through the radiatedinterrogation field 54. The antenna 64 passes received interrogationsignals 56 to the communication electronics 60. The communicationelectronics 60 includes circuitry necessary to interpret theinterrogation signal 56 from the field 54 and to further communicate theinterpreted interrogation signal 56 to the control system 58. Thecontrol system 58 may include an integrated circuit, printed circuitboard, or other type of microprocessor or micro-controller electronicsthat controls the operations of the RFID tag 10. The control system 58is connected to the communication electronics 60 to communicate andreceive transmissions. The control system 58 is also connected to thememory 62 for storing and retrieving information. The control system 58may further include a clock (not shown). The control system 58determines if any actions are needed in response to the communicationsreceived from the communication electronics 60.

FIG. 9 also illustrates how communication is achieved with the low andnarrow-profile RFID tag 10 using the interrogator 52. The interrogator52 includes interrogation communication electronics 68 and aninterrogation antenna 70. The interrogation reader 52 communicates withthe RFID tag 10 by emitting the interrogation signal 56 modulated in afrequency by the interrogation communication electronics 68 through theinterrogation antenna 70. The interrogation antenna 70 may be any typeof antenna that can radiate the interrogation signal 56 through thefield 54 so that a compatible device, such as the low and narrow-profileRFID tag 10, can receive the signal 56 through its own antenna 64. Thefield 54 could be electro-magnetic, magnetic, or electric. Theinterrogation signal 56 includes a message containing information or aspecific request for the RFID tag 10.

When the antenna 64 is in the presence of the field 54 emitted by theinterrogator 52, the communication electronics 60 are energized by thesignal 56, thereby energizing the RFID tag 10. The RFID tag 10 remainsenergized so long as the antenna 64 is in the field 54 of theinterrogator 52. The communication electronics 60 demodulates theinterrogation signal 56 and sends the message containing the informationor the specific request to the control system 58 for appropriateactions. For example, the request may be for the RFID tag 10 tocommunicate its identification, or information about a material orpackage associated with the RFID tag 10, such as date of manufacture,place of manufacture, and/or lot number. The message may also be arequest for information regarding ambient or environmental measurementssensed by the sensor 66.

Another description of the RFID tag 10 that may be used with the presentinvention is located in U.S. Pat. No. 5,347,280, entitled “FREQUENCYDIVERSITY TRANSPONDER ARRANGEMENT” to Schuermann, which is incorporatedherein by reference in its entirety. The RFID tag 10 is one type ofwireless communication device. Other types of wireless communicationdevices may be used with the present invention. For instance, the lowand narrow-profile RFID tag 10 may have a transmitter that can sendinformation to the interrogator 52 without having to alter theinterrogation signal 56. The RFID tag 10 may include a battery (notshown) to power the transmitter, or an energy storage unit (not shown)that is charged by energy received from the interrogation signal 56 whenthe RFID tag 10 is within range of the field 54. It is readilyunderstood to one of ordinary skill in the art that there are many othertypes of wireless communications devices and communication techniquesthan those described herein, and the present invention is not limited toa particular type of device, technique, or method.

The RFID tag 10 may be attached to any type of device or package toidentify and communicate information concerning the device or package.For instance, the RFID tag 10 may be attached to a food package and maycontain identification information and other information about the foodcontained inside the package, such as its date of manufacture, “born on”date, expiration date for sale, or consumption and lot number. Forexample, the RFID tag 10 may be attached to a wine bottle and containinformation concerning the type of wine and its ingredients or make up,the date of manufacture, and the expiration date. The RFID tag 10 may beattached to virtually any device or package conceivable, and isparticularly well suited for use in applications including a metalsurface or irregularly-shaped product package.

Further enhancements to the RFID tags 10 of the present invention arepossible. Environmental contaminants, water, temperature, and impact canaffect the functionality and usable life of an electronic device. Assuch, the embodiments that follow describe various exemplaryenvironmental encapsulates that may be used to protect the RFID tag 10of the present invention from environmental contaminants, water,temperature, and impact.

FIG. 10 illustrates an exemplary low and narrow-profile RFID deviceencapsulated within a shrink wrap material 80 to shield the low andnarrow-profile RFID tag 10 from environmental contaminants, water,temperature, and impact. The shrink wrap material 80 encapsulates theentire RFID tag 10 and may be any commercially-available shrink wrapmaterial, such as a heat shrink-type material that used within theelectronics industry. The shrink wrap material 80 may be placed over theRFID tag 10 and activated by heating to cause the shrink wrap material80 to shrink and seal against the contours of the RFID tag 10. The endsof the shrink wrap material 80 are sealed to prevent contamination ofthe RFID tag 10.

FIG. 11 illustrates an exemplary low and narrow-profile RFID deviceencapsulated within a pre-molded case 82 to shield the low andnarrow-profile RFID tag 10 from environmental contaminants, water,temperature, and impact. The use of the pre-molded case 82 may furtherincrease rigidity of the RFID tag 10. The ends of the pre-molded case 82are sealed to prevent contamination of the RFID tag 10. The RFID tag 10may alternatively be encapsulated with shrink wrap, such as the shrinkwrap material 80, prior to placement within the pre-molded case 82 foradditional protection from the elements.

FIG. 12 illustrates an exemplary rapid-wrap packaging embodiment of thelow and narrow-profile RFID tag 10. A rapid-wrap packaging 84 provides amethod of attachment of the RFID tag 10 to tubing and other roundsurfaces. By packaging the RFID tag 10 with the rapid-wrap packaging 84,the RFID tag 10 may be installed on tubular surfaces and the rapid-wrappackaging 84 may be used to hold the RFID tag 10 to the tubular surfacewithout additional fasteners if desired. The rapid-wrap packaging 84recoils when released after being unrolled. As such, the rapid-wrappackaging 84 with the RFID tag 10 attached to its inner surface may beattached to a cylindrical surface by unrolling, at least partially, therapid-wrap packaging 84, placing a first edge of the at least partiallyunrolled rapid-wrap packaging 84 onto the cylindrical surface, andallowing the rapid-wrap packaging 84 to recoil around the cylindricalsurface to attach the RFID tag 10 to the cylindrical surface. Tape 86secures the RFID tag 10 to the inside curved surface of the rapid-wrappackaging 84. The RFID tag 10 may alternatively be encapsulated with anenvironmental encapsulate prior to securing the RFID tag 10 to theinside curved surface of the rapid-wrap packaging 84. The environmentalencapsulate may be used, as elsewhere described herein, to shield theRFID tag 10 from environmental contaminants, water, temperature, andimpact.

FIG. 13 illustrates an exemplary rapid-wrap packaging embodiment of thelow and narrow-profile RFID tag 10 attached to a section of scaffolding88 to identify the section of scaffolding 88. The rapid-wrap packaging84 has been secured to the section of scaffolding 88 with the RFID tag10 attached to the inside curved surface of the rapid-wrap packaging 84.The rapid-wrap packing 84 curves onto itself to allow quick fastening ofthe RFID tag 10 to the scaffolding 88. Due to the curved cylindricalnature of the rapid-wrap packaging 84 and the fact that it curves ontoitself, the RFID tag 10 may remain in place on the section ofscaffolding 88 without additional mechanical fasteners. However, tape,glue, or another fastener may be used to further secure the RFID tag 10to the section of scaffolding 88 as desired.

FIG. 14 illustrates an exemplary low and narrow-profile RFID tag withcurve set capabilities provided by placing one or more wires 90 beneaththe magnetic-base material 22 of the low and narrow-profile RFID tag 10to allow the RFID tag 10 to be shaped into a contour of a surface, suchas the metal surface 24, and to hold the contoured shape, therebyreducing stress on fastening materials. The wire(s) 90 may be of anysuitable gauge to allow the curve set capabilities of the RFID tag 10 tomaintain contoured shape of the surface to which it is to be attached.Although not depicted in FIG. 14, an environmental encapsulate, such asthe environmental encapsulate 38, may be formed to shield the RFID tag10 from environmental contaminants, water, temperature, and impact.

FIG. 15 illustrates an exemplary cross section of a low andnarrow-profile RFID tag with curve set capabilities showing two wires 90beneath the magnetic-base material 22 of the low and narrow-profile RFIDtag 10 to allow the device to be shaped into a contour of a surface andto hold the shape, thereby reducing stress on fastening materials. Assuch, the RFID tag 10 may be formed into the shape of an uneven surfacewith one or more contours to allow the RFID tag 10 to create a smallerobtrusion from the surface of the object to be tagged. The RFID tag's 10capability of being formed to fit in close contact with the surface ofthe object to be tagged reduces contact with the RFID tag 10 duringshipping and storage and less lateral force may be imparted to the RFIDtag 10 if an object does come into contact with the RFID tag 10. Theenvironmental encapsulate 38 is formed around the RFID tag 10 with thetwo wires 90 beneath the magnetic-base material 22. Accordingly, the twowires 90 form an integral part of the RFID tag 10. It should be notedthat any number of wires may be used within an embodiment such as thatdescribed within FIG. 15, provided that the gauge selection of thechosen number of wires is such that the curve set capabilities areprovided. Furthermore, the environmental encapsulate 38 is illustratedas encapsulating the wires 90. The wires 90 may alternatively befastened to the exterior of the RFID tag 10.

FIG. 16 illustrates an exemplary low and narrow-profile RFID tag withcurve set capabilities and a heat shrink encapsulate 92 bent into an arcfor placement on a curved surface. The heat shrink encapsulate 92 is anexemplary embodiment of the shrink wrap material 80 described inassociation with FIG. 10 above and may be any commercially availableproduct that shrinks when heat is applied to cause the heat shrinkencapsulate 92 to form to a surface. The low and narrow-profile RFID tag10 with curve set capabilities maintains its shape and bend to reducestress on mechanical fasteners. Further, the RFID tag 10 may be placedwithin the rim of hats or helmets, on a curved cylinder surface, and anyother uneven surface. The ends of the heat shrink encapsulate 92 arecrimped to further protect the RFID tag 10.

FIG. 17 illustrates an exemplary low and narrow-profile RFID tag 10 witha slotted mechanical impact barrier 94 providing additional protectionfrom impact with slots 96 providing signaling pathways through theslotted mechanical impact barrier 94. The embodiment depicted withinFIG. 17 is particularly well suited for harsh situations, such asconstruction situations, which may threaten the mechanical integrity ofthe RFID tag 10. By use of a mechanical barrier, such as the slottedmechanical impact barrier 94, RF performance may be maintained for theRFID tag 10 while improving mechanical impact resistance significantlyrelative to both conventional RFID tags and embodiments without aslotted mechanical impact barrier 94. The present embodiment providesthe slots 96, which are cut at intervals along a length of the slottedmechanical impact barrier 94, to provide spacing sufficient to reduce anRFID shielding effect that would otherwise result from a metal coveringof the RFID tag 10. As such, a useable RFID signal level and readperformance may be maintained while mechanically protecting the RFID tag10. Exemplary spacing for the slots 96 include spacing such as ½″, 1″,and ¾″, etc. It should be noted that slotted mechanical impact barriersof any shape may be used, such as angle iron, rectangular tubing, orcylindrical tubing, for example, depending upon the desired application.Accordingly, any such shape is considered within the scope of thesubject matter described herein.

The low and narrow-profile RFID tag 10 may be directly attached to theunderside of a mechanical impact barrier, such as the slotted mechanicalimpact barrier 94, and may realize similar read performance as when theRFID tag 10 is mounted directly to the surface of an object to betagged. Further, it is anticipated that the surface of the slots 96 mayactually enhance the RF performance of the RFID tag 10 in addition toallowing RF energy to leak into the space under the slotted mechanicalimpact barrier 94 to allow communication with the RFID tag 10. The RFIDtag 10 may be fasted to the underside of the slotted mechanical impactbarrier 94 by any suitable means, including tape, glue, or any otherfastener.

The slotted mechanical impact barrier 94, including the RFID tag 10, maybe attached to a surface to be identified, such as a construction pipe,by direct welding, metal or fiber straps, a rugged tape of belts, or anyother fastener suitable for use with the mounting surface. Analternative means to attaching the slotted mechanical impact barrier 94,including the RFID tag 10, to an object to be identified is to cut apair of horizontal slots 98 (one shown within FIG. 17) just above thebase of the slotted mechanical impact barrier 94. The horizontal slot 98will allow a strap 100 to be passed through the horizontal slots 98 atthe base and then around the object to be identified. Accordingly, thestrap 100 may remain close to the object as it bands the slottedmechanical impact barrier 94, including the RFID tag 10, to the object.

Accordingly, many approaches to attaching the RFID tag 10 to the slottedmechanical impact barrier 94 and for attaching the slotted mechanicalimpact barrier 94, including the RFID tag 10, to an object are possible.For a further example, the RFID tag 10 may be strapped to the object tobe identified and the slotted mechanical impact barrier 94 may bestrapped to the object over the strapped RFID tag 10. Alternatively, asdescribed above, the RFID tag 10 may include a slot for strapping theRFID tag 10 to an object to be identified. In such an embodiment, astrap may then be passed through a first of the horizontal slots 98 inthe slotted mechanical impact barrier 94, then through the slot in theRFID tag 10 as described above, and then through the second of thehorizontal slots 98 in the slotted mechanical impact barrier 94 tocouple the RFID tag 10 to the mechanical impact barrier 94. Thisassembly may then be strapped to the object to be identified, such as aconstruction pipe or other surface, to secure the mechanical impactbarrier 94 and the RFID tag 10 to the surface. An approach which uses ahorizontal slot 98 may prevent the strapping material from wearing orbreaking due to mechanical abrasion of the strapping material againstthe slotted mechanical impact barrier 94 or another surface duringshipping or storage of the object to be identified.

As another alternative, the slots 96 may either be left open or may befilled with filler such as silicone, epoxy, or the like to add furtherenvironmental protection to the RFID tag 10. Such an embodiment mayprevent sludge, mud, and debris from plugging the slots 96. Thesefillers are known not to interfere with RF energy. As such, the RFID tag10 may be further protected from environmental conditions whilemaintaining sufficient RF read performance.

FIG. 18 illustrates an exemplary cross section of a low andnarrow-profile RFID tag 10 with a rubber encapsulate 102, such aspolyurethane, vulcanized rubber, or a similar material, to provideadditional mechanical impact protection in addition to environmentalencapsulation. An additional benefit to use of the rubber encapsulate102 is flexibility of the RFID tag 10 for installation purposes. Assuch, the RFID tag 10 may be mounted around the circumference of a roundsurface, such as a pipe or gas cylinder, or on a curved surface.Furthermore, in combination with the curve set capabilities describedabove, forces imparted to fastening materials may be reduced. The rubberencapsulate 102, including the RFID tag 10, may be strapped directly toan object to be identified, or may be used in conjunction with theslotted mechanical impact barrier 94 described above in association withFIG. 17.

FIG. 19 illustrates an exemplary low and narrow-profile RFID tag 10 withthe rubber encapsulate 102, such as vulcanized rubber, attached to apiece of pipe 104 with a strap 106. As described above, curve setcapabilities may be combined with the vulcanized rubber embodiment toprovide the RFID tag 10 with the capability of retaining the shape ofthe surface to which it is to be attached. Alternatively, in addition tothe embodiment illustrated within FIG. 19 where mounting iscircumferential, the RFID tag 10 encapsulated within the rubberencapsulate 102 may be attached to the pipe 104 axially with respect tothe pipe 104.

FIG. 20 illustrates an exemplary low and narrow-profile RFID tag 10 withthe rubber encapsulate 102, such as vulcanized rubber, and an integratedo-ring 108 for allowing the device to be readily attached to a round oruneven surface. The integrated o-ring 108 may be dimensioned for thedesired diameter or cross-section of the object to be identified. Assuch, integrated o-rings 108 of different sizes may be provided forattachment to objects of varying diameter or cross-section size. TheRFID tag 10 encapsulated within the rubber encapsulate 102 and theintegrated o-ring 108 may be formed by including an existing o-ring 108into a mold during formation and curing in the vulcanizing process.

FIG. 21 illustrates an exemplary low and narrow-profile RFID tag 10 withthe rubber encapsulate 102, such as vulcanized rubber, and theintegrated o-ring 108 attached to the pipe 104. The diameter of the pipe104 matches with the selected dimension of the integrated o-ring 108 tominimize stress on the RFID tag 10 and the rubber encapsulate 102.Additionally, as described above, curve set capabilities may beintegrated to further reduce stresses at attachment points and toincrease conformity with curved surfaces.

FIG. 22 illustrates an exemplary cross section of the low andnarrow-profile RFID tag 10 within the rubber encapsulate 102, such asvulcanized rubber, with reinforced pre-hardened rubber strips 108 placedalong the length of the RFID tag 10 for additional impact protection.The reinforced pre-hardened rubber strips 110 placed along the length ofthe RFID tag 10 add additional lateral rigidity to the RFID tag 10. Thewires 90 are illustrated to provide the curve set capabilities describedabove. Alternatively, the wires 90 may be left out of the embodiment asdesired. Additionally, more wires 90 may be placed axially relative tothe length of the RFID tag 10, including placing wires above or belowthe reinforced pre-hardened rubber strips 110 along the sides of theRFID tag 10 without departure from the scope of the subject matterdescribed herein.

FIG. 23 illustrates an exemplary ring tag low and narrow-profile RFID 10device within a rubber encapsulate 112, such as rubber tubing, andformed into a ring for attachment to round objects of a given diameter.The rubber encapsulate 112 may be fastened at the ends 114 and 116 witha fastener 118. The fastener 118 may be tape, shrink wrap, or any othermaterial capable of securing the ends 114 and 116 of the rubberencapsulate 112. The RFID tag 10 is placed inside of the rubberencapsulate 112 prior to sealing the ends and may be further protectedby an environmental encapsulate, such as the environmental encapsulate38, in the form of shrink wrap or another material, to enhanceenvironmental ruggedness. Curve set capabilities, as described above,may be integrated into the RFID tag 10 to reduce stresses on the rubberencapsulate 112 and the fastener 118.

Within the foregoing description, many embodiments of the low andnarrow-profile RFID tag 10 have been described. Many combinations ofthese embodiments are possible and all are considered within the scopeof the subject matter described herein.

The Appendix to this specification includes the three provisionalapplications referenced above within the “Related Applications” sectionin their entirety and provides further details and alternateembodiments. The Appendix is incorporated herein by reference in itsentirety.

Those skilled in the art will recognize improvements and modificationsto the preferred embodiments of the present invention. All suchimprovements and modifications are considered within the scope of theconcepts disclosed herein and the claims that follow.

1. A wireless communication device, comprising: a radio frequencyidentification (RFID) tag, comprising: an RFID circuit packaged within achip carrier package, wherein the chip carrier package bonds out atleast a first antenna connection for the RFID circuit; an antennaincluding at least a first conductive lead interfaced with the at leastthe first antenna connection; a first spacer having a first dielectricconstant, wherein the chip carrier package and the at least the firstconductive lead are coupled to a first side of the first spacer; and asecond spacer having a second dielectric constant greater than the firstdielectric constant and coupled to a second side of the first spacer,wherein the second spacer is adapted to isolate the RFID circuit from ametal surface.
 2. The wireless communication device of claim 1 whereinthe antenna further comprises an antenna selected from a groupconsisting of a monopole antenna and a dipole antenna.
 3. The wirelesscommunication device of claim 1 wherein the antenna further comprises anantenna selected from a group consisting of a braided wire antenna, asingle wire spring antenna, and a single wire antenna.
 4. The wirelesscommunication device of claim 1 further comprising a circuit board uponwhich the chip carrier package is mounted and wherein the at least thefirst conductive lead is interfaced with the at least the first antennaconnection via at least a first circuit connection on the circuit board.5. The wireless communication device of claim 4 wherein the chip carrierpackage is coupled to the first side of the first spacer via the circuitboard.
 6. The wireless communication device of claim 1 wherein the atleast the first conductive lead of the antenna further comprises a solidwire.
 7. The wireless communication device of claim 1 wherein the atleast the first conductive lead of the antenna further comprises braidedwires.
 8. The wireless communication device of claim 1 wherein the atleast the first conductive lead of the antenna further comprises aspring-shaped wire.
 9. The wireless communication device of claim 1wherein the at least the first conductive lead includes a first andsecond end and, in being interfaced with the at least the first antennaconnection, the at least the first conductive lead is interfaced at therespective first end.
 10. The wireless communication device of claim 9wherein the second end of the at least the first conductive lead furthercomprises a metal tab, wherein the metal tab is adapted to be cut toallow frequency tuning of the RFID circuit.
 11. The wirelesscommunication device of claim 1 further comprising at least one wirecoupled to the RFID tag and adapted to cause the RFID tag to remainformed in a shape to which the at least one wire is bent.
 12. Thewireless communication device of claim 11 wherein the at least one wireis coupled to the RFID tag on a second side of the second spacer. 13.The wireless communication device of claim 11 further comprising anenvironmental encapsulate adapted to enclose at least a portion of theat least one wire.
 14. The wireless communication device of claim 1further comprising an environmental encapsulate enclosing at least aportion of the RFID tag and adapted to protect the RFID tag from atleast one of a contaminant, water, temperature, and impact.
 15. Thewireless communication device of claim 14 wherein the environmentalencapsulate further comprises at least one of shrink wrap and a pre-moldcase.
 16. The wireless communication device of claim 14 wherein theenvironmental encapsulate further comprises a slotted mechanical impactbarrier.
 17. The wireless communication device of claim 16 wherein theslotted mechanical impact barrier is further adapted to allow radiofrequency energy to pass through RF slots in the slotted mechanicalimpact barrier, and the RF slots are approximately perpendicular to alength of the slotted mechanical impact barrier.
 18. The wirelesscommunication device of claim 17 wherein the RF slots in the slottedmechanical impact barrier are filled with at least one of silicone andepoxy.
 19. The wireless communication device of claim 16 wherein theslotted mechanical impact barrier further comprises at least one strapslot adapted to receive a strap useable for strapping the slottedmechanical impact barrier to an object to be identified, wherein the atleast one strap slot is approximately parallel to a length of theslotted mechanical impact barrier.
 20. The wireless communication deviceof claim 19 wherein the environmental encapsulate further comprises atleast one encapsulate slot adapted to receive the strap, and the atleast one encapsulate slot is approximately parallel to a length of theRFID tag.
 21. The wireless communication device of claim 14 wherein theenvironmental encapsulate further comprises vulcanized rubber.
 22. Thewireless communication device of claim 21 wherein the environmentalencapsulate further comprises an o-ring integrated into the vulcanizedrubber.
 23. The wireless communication device of claim 21 wherein theenvironmental encapsulate further comprises reinforced pre-hardenedrubber strips.
 24. The wireless communication device of claim 14 whereinthe environmental encapsulate further comprises a rubber encapsulate,wherein the RFID tag and the rubber encapsulate are formed and securedto form a ring.
 25. The wireless communication device of claim 24wherein the RFID tag and the rubber encapsulate are secured via at leastone of tape and shrink wrap.
 26. The wireless communication device ofclaim 14 wherein the environmental encapsulate further comprises arolled flexible cylindrical material suitable for mounting the RFID tagon a cylindrical surface.
 27. The wireless communication device of claim26 wherein the RFID tag is mounted on an inside surface of the rolledflexible cylindrical material.
 28. A method of manufacture for awireless communication device, comprising the steps of: manufacturing aradio frequency identification (RFID) tag, wherein the RFID tag ismanufactured by: placing an RFID circuit within a chip carrier package,wherein the chip carrier package bonds out at least a first antennaconnection for the RFID circuit; attaching an antenna to the RFIDcircuit, wherein the antenna includes at least a first conductive leadinterfaced with the at least the first antenna connection; coupling afirst side of a first spacer having a first dielectric constant to thechip carrier package and the at least the first conductive lead; andcoupling a second spacer having a second dielectric constant greaterthan the first dielectric constant to a second side of the first spacer,wherein the second spacer is adapted to isolate the RFID circuit from ametal surface.
 29. A method of attaching a wireless communication deviceto a cylindrical surface, comprising: attaching wireless communicationelectronics to an inside surface of a flexible cylindrical material,wherein the flexible cylindrical material recoils when released afterbeing unrolled; and unrolling, at least partially, the flexiblecylindrical material; placing a first edge of the at least partiallyunrolled flexible cylindrical material onto the cylindrical surface; andallowing the flexible cylindrical material to recoil around thecylindrical surface to attach the wireless communication electronics tothe cylindrical surface.
 30. The wireless communication device of claim29 further comprising encapsulating at least a portion of the wirelesscommunication electronics within an environmental encapsulate to protectthe wireless communication electronics from at least one of acontaminant, water, temperature, and impact.
 31. The wirelesscommunication device of claim 30 further comprising fastening tape to asecond edge of the flexible cylindrical material and to an outer surfaceof the flexible cylindrical material near the second edge of theflexible cylindrical material.
 32. A wireless communication device,comprising: wireless communication electronics; at least a first antennaconnection coupled to the wireless communication electronics; and abraided wire antenna including at least a first braided conductive leadinterfaced with the at least the first antenna connection.
 33. Thewireless communication device of claim 32 wherein the braided wireantenna further comprises a braided wire antenna selected from a groupconsisting of a monopole braided wire antenna and a dipole braided wireantenna.
 34. The wireless communication device of claim 32 furthercomprising a circuit board upon which the wireless communicationelectronics are mounted and wherein the at least the first braidedconductive lead is interfaced with the at least the first antennaconnection via at least a first circuit connection on the circuit board.35. The wireless communication device of claim 34 wherein the wirelesscommunication electronics are coupled to a first side of a first spacervia the circuit board.
 36. The wireless communication device of claim 32wherein the at least the first braided conductive lead includes a firstand second end and, in being interfaced with the at least the firstantenna connection, the at least the first braided conductive lead isinterfaced at the respective first end.
 37. The wireless communicationdevice of claim 36 wherein the second end of the at least the firstbraided conductive lead further comprises a metal tab, wherein the metaltab is adapted to be cut to allow frequency tuning of the wirelesscommunication electronics.
 38. The wireless communication device ofclaim 32 further comprising at least one wire coupled to the wirelesscommunication electronics and adapted to cause the wirelesscommunication electronics to remain formed in a shape to which the atleast one wire is bent.
 39. The wireless communication device of claim38 further comprising an environmental encapsulate adapted to enclose atleast a portion of the at least one wire.
 40. The wireless communicationdevice of claim 32 further comprising an environmental encapsulateenclosing at least a portion of the wireless communication electronicsand adapted to protect the wireless communication electronics from atleast one of a contaminant, water, temperature, and impact.
 41. Thewireless communication device of claim 40 wherein the environmentalencapsulate further comprises at least one of shrink wrap and a pre-moldcase.
 42. The wireless communication device of claim 40 wherein theenvironmental encapsulate further comprises a slotted mechanical impactbarrier.
 43. The wireless communication device of claim 42 wherein theslotted mechanical impact barrier is further adapted to allow radiofrequency energy to pass through RF slots in the slotted mechanicalimpact barrier, and the RF slots are approximately perpendicular to alength of the slotted mechanical impact barrier.
 44. The wirelesscommunication device of claim 43 wherein the RF slots in the slottedmechanical impact barrier are filled with at least one of silicone andepoxy.
 45. The wireless communication device of claim 42 wherein theslotted mechanical impact barrier further comprises at least one strapslot adapted to receive a strap useable for strapping the slottedmechanical impact barrier to an object to be identified, wherein the atleast one strap slot is approximately parallel to a length of theslotted mechanical impact barrier.
 46. The wireless communication deviceof claim 45 wherein the environmental encapsulate further comprises atleast one encapsulate slot adapted to receive the strap, and the atleast one encapsulate slot is approximately parallel to a length of thewireless communication electronics.
 47. The wireless communicationdevice of claim 40 wherein the environmental encapsulate furthercomprises vulcanized rubber.
 48. The wireless communication device ofclaim 47 wherein the environmental encapsulate further comprises ano-ring integrated into the vulcanized rubber.
 49. The wirelesscommunication device of claim 47 wherein the environmental encapsulatefurther comprises reinforced pre-hardened rubber strips.
 50. Thewireless communication device of claim 40 wherein the environmentalencapsulate further comprises a rubber encapsulate, wherein the wirelesscommunication electronics and the rubber encapsulate are formed andsecured to form a ring.
 51. The wireless communication device of claim50 wherein the wireless communication electronics and the rubberencapsulate are secured via at least one of tape and shrink wrap. 52.The wireless communication device of claim 40 wherein the environmentalencapsulate further comprises a rolled flexible cylindrical materialsuitable for mounting the wireless communication electronics on acylindrical surface.
 53. The wireless communication device of claim 52wherein the wireless communication electronics are mounted on an insidesurface of the rolled flexible cylindrical material.